An effective thermal transfer grease with thermal conductivity of 2.0 W/(m·K) Silicone-free Broad service temperature range of -70 to 165 °C (-90 to 329 °F) High dielectric strength Excellent corrosion resistance – passed ASTM B117 salt fog test (1,000 hours) Non-bleeding Non-electrically conductive Long service life
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Thermal Compound Paste, Carbon Based High Performance, Heatsink Paste, Thermal Compound CPU for All Coolers, Thermal Interface Material
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CircuitWorks® Thermal Paste facilitates heat transfer away from electrical/electronic components. This heavy consistency material is thickened with a
CircuitWorks Thermal Paste
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TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
TG-30 Thermal Compound
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•SAFETY APPLICATION: is metal-free and non-conductive, which eliminates any risk of short circuit and adds more protection to the CPU and VGA .,
Thermal Paste, 1.8g CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High
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