ZM-STC7 Thermal Paste, 4g

4.8 (398) · € 4.50 · En stock

Excellent Stability: STC7 thermal conductivity allows heat from CPU or any computer chips to cool down and is very safe as there is no electrical conductivity: Measuring Graduation: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product. Optimal Viscosity:
Excellent Stability: STC7 thermal conductivity allows heat from CPU or any computer chips to cool down and is very safe as there is no electrical conductivity: Measuring Graduation: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product. Optimal Viscosity: Particle size technology provides optimal filler density to conveniently use on any type of computer chips. 220 Pa.s. Easy to Use and Store: Syringe style is easy to use and rubber-cap prevents liquid content from being hardened over a period of time if reusing is needed Outstanding Durability: Fine micro particles fill up space between the heatsink and CPU to maximize cooling performance & RoHS Certified

Zalman STC7 Thermal Paste, 4g Superconducting CPU Thermal Grease for All Processors, IC, PC Coolers, Xbox, PS4, Computer Heatsink, Micro-Filler Density Technology, 7.2 W/m-k, 220 Pa.s (ZM-STC7) : Electronics

Zalman Thermal compound 7.2W/mK 4g - ZM-STC7 - English

Термопаста Zalman ZM-STC7 4g - купить комплектующие ПК по низкой цене в Киеве и Украине

Zalman термо паста Thermal compound 7.2W/mK 4g -,ниски цени

Zalman термо паста Thermal compound 9.1W/mK 4g – ZM-STC9 – Баланс 37

Zalman ZM-STC7 4Gr Termal Macun

Arctic MX-6 Thermal Compound 4gr - English

Zalman ZM-STC7, Thermal Compound Paste, 4gm, Grey, 1 Year Warranty - AGZ Technology

Zalman STC9 Thermal Paste, 4g Premium Compound for All Processors, CPU Cooler Heatsink, PS5, Xbox, Gaming Console, GPU, Superconducting Micro-Filler Density Technology, 9.1 W/m-k (ZM-STC9) : Electronics

ZM-STC8 highly effective thermal conductivity allows heat from CPU or any computer chips to cool down very safe as there is no electrical conductivity. Particle size technology provides optimal filler density to conveniently use on any type of computer chips. ZM-STC8 can fill up space between the heat sink and CPU to maximize cooling performance.